MediaTek announced its latest midrange chipset with the Dimensity 6300. This is a successor to last year’s Dimensity 6100+ featuring an overclocked main Cortex-A76 CPU cluster now working at 2.4Ghz instead of 2.2Ghz. The 2x Cortex-A76 cores are joined by 6x Cortex-A55 clocked at 2GHz.
Dimensity 6300 is manufactured on TSMC’s 6nm process and features a Mali-G57 MC2 GPU. MediaTek claims the new chip should offer a 10% boost in CPU performance compared to the outgoing 6100+.
Dimensity 6300 also features MediaTek UltraSave 3.0+ technology for power saving and an integrated 5G modem compliant wit the 3GPP Release 16 standard.
The chip supports the same LPDDR4x RAM and UFS 2.2 storage as its predecessor and can power displays of up to 1080 x 2520px resolution. It supports up to 108MP main cameras, dual-band Wi-Fi 5 (a/b/g/n/ac) and Bluetooth 5.2 connectivity.
Realme C65 5G is expected to be the first phone to launch with the Dimensity 6300 later this month.
